在電子產(chǎn)品制造應(yīng)用中，印刷電路板裝配在很大程度上是以自動化方式完成的。各種不同設(shè)計的機(jī)器人負(fù)責(zé)執(zhí)行SMD放置、焊接、自動化光學(xué)檢測（AOI）等步驟。但到目前為止，電容器、電源線圈、連接器等有線組件的通孔安裝一直是例外。此步驟目前仍然主要是通過手動裝配完成的，原因在于這是一個復(fù)雜的過程，無法輕松實現(xiàn)自動化。

這正是位于德國薩爾茨基特市（Salzgitter)

解決此挑戰(zhàn)是開發(fā)解決方案的主要動機(jī)。Glaub的團(tuán)隊充滿熱情地投入工作，該解決方案現(xiàn)已投入使用，其完全不同于常規(guī)解決方案。裝配過程是由來自ABB的雙臂協(xié)作YuMi機(jī)器人完成的，憑借兩個機(jī)械臂，該機(jī)器人組裝電路板的速度是傳統(tǒng)機(jī)器人的兩倍。

超緊湊型“GL-THTeasy”機(jī)器人作業(yè)單元的自動化過程如下所述：通過輸送帶向機(jī)器人提供裝有電容器的泡罩包裝。泡罩包裝上的DataMatrix碼可幫助識別物品。然后，YuMi從泡罩包裝中一個接一個地抓取電容器，并將其精確地放置在印刷電路板上?；蛘?，它也可以從ESD容器中或者振動輸送帶上取出或取下電子組件。隨后立即從下方進(jìn)行焊接。該裝置將通過再循環(huán)系統(tǒng)將空的泡罩包裝移除，然后將裝有電容器的泡罩包裝自動送入。

有針對性的裝運(yùn)箱拾取

到目前為止，這一切聽起來都很合乎邏輯，我們可能會奇怪，為什么此裝配過程之前沒有實現(xiàn)自動化。答案在于：機(jī)器人無法應(yīng)對組件進(jìn)給的高度可變性和組件定位的細(xì)微誤差。這意味著之前的一些機(jī)器人解決方案在編程方面非常復(fù)雜和繁瑣，而且在實踐中并不特別可靠。

但是，Glaub的新型機(jī)器人作業(yè)單元首次使用智能相機(jī)，擁有來自康耐視的先進(jìn)圖像處理技術(shù)?？的鸵暿枪I(yè)圖像處理領(lǐng)域的市場領(lǐng)導(dǎo)者之一。通過使用3D表面?zhèn)鞲衅鱽頇z測泡罩包裝中組件的位置，該傳感器還允許從裝運(yùn)箱中或振動輸送帶上進(jìn)行有針對性的拾取，以便隨后使用2D相機(jī)進(jìn)一步測量電容器和印刷電路板。

>機(jī)器人技術(shù)與圖像處理的智能結(jié)合

因此，圖像處理對于該概念取得成功起著至關(guān)重要的作用。Glaub的工程師與位于德國溫德堡（Wendeburg）的M-VIS Solutions GmbH合作，選擇了適合該應(yīng)用的智能相機(jī)。康耐視的解決方案合作伙伴M-VIS公司開發(fā)了一種使用多臺智能相機(jī)的解決方案，這些相機(jī)用于采集泡罩包裝上的DataMatrix碼，并精確地測量和定位每個單獨(dú)的組件。

M-VIS Solutions首席執(zhí)行官Vitali Burghardt解釋道：“通過對組件和印刷電路板進(jìn)行100%的絕對測量，GL-THTeasy可以彌補(bǔ)組件、抓取、工件托架和輸送帶方面的所有誤差?！?這意味著不完全匹配的組件將會被立即移除。

每個作業(yè)單元配備8臺相機(jī)，包括2臺3D相機(jī)

作為可行性研究的一部分，M-VIS（由康耐視提供支持）選擇了8臺相機(jī)，每個機(jī)械臂配備4臺。1套In-Sight 7802M視覺系統(tǒng)用于測量元件，并提供必要的信息，以糾正夾持器的位置。另一套In-Sight 9912M系列視覺系統(tǒng)用于測量電路板，并在必要時糾正夾持器的動作，以將組件準(zhǔn)確地放置在電路板上。3D-A5060是一款3D表面掃描相機(jī)，其配備康耐視正在申請專利的3D LightBurst技術(shù)，并內(nèi)置VisionPro圖像處理軟件，可以清楚地“看到”元件在進(jìn)料線上的位置。

此外，這種方法還有一個優(yōu)勢：由于運(yùn)動是基于相機(jī)控制的，因此操作員無需編程即可生成新的放置模型。所產(chǎn)生的相機(jī)圖像將作為該操作的基礎(chǔ)。這不僅簡化和加快了裝配，同時也簡化和加快了生產(chǎn)線轉(zhuǎn)換。因此，GL-THTeasy機(jī)器人作業(yè)單元提供了靈活自動化的關(guān)鍵示例，可為滿足當(dāng)前和未來需求提供智能解決方案。

縮短周期時間并加快成本攤銷

ABB YuMi機(jī)器人的兩個機(jī)械臂可全天候同時工作，從而能夠以非常短的周期時間高速進(jìn)行24/7操作，根據(jù)需要安裝的組件和給料類型，該時間可能不到3秒。成本攤銷周期也令人印象深刻，距離GL-THTeasy機(jī)器人首次投入使用僅約14個月。因此，新的機(jī)器人作業(yè)單元在多個方面的得分都很高，這有力地支持了其應(yīng)用，包括創(chuàng)新、可靠性、效率和未來可行性。毫無疑問，繼Glaub和M-VIS之后，這種智能解決方案將在未來吸引許多其他電子制造公司以這種靈活、高效的方法來實現(xiàn)印刷電路板裝配工藝步驟自動化。

This challenge was the major incentive to developing a solution. Glaub's team enthusiastically set to work and the solution is now already being used — and it is highly unconventional. The assembly is done by a dual-arm collaborative YuMi robot from ABB, which — thanks to its two arms — can assemble the circuit boards twice as fast as a conventional robot.

The automated process in the ultra-compact “GL-THTeasy” robot cell takes place as follows: The robot is provided with blister packs with capacitors, for example, via a conveyor line. A data matrix code on the blister pack allows the item to be identified. YuMi then grips one capacitor after another from the blister pack and places it precisely on the printed circuit board. Alternatively, it can also remove the electronic components from an ESD container, for example, or a vibratory conveyor. This is immediately followed by soldering from below. Empty blister packs are removed by the installation via a recirculation system and full ones are then automatically fed in.

Targeted bin picking

This all sounds quite logical so far, and we may wonder why this assembly process was not automated before now. The answer: robotics was unable to cope with either the high variability in the component feeding or the slight inaccuracies in positioning the components. This meant that the few previous robotic solutions were extremely complex, elaborate in terms of programming, and not particularly reliable in practice.

However, Glaub's new robot cell uses smart cameras for the first time, boasting state-of-the-art image processing technology from Cognex, the market leader in industrial image processing. The position of the components in the blister packs is detected using 3D surface sensors — which also allow targeted picking from the bin or the vibratory conveyor, in order to then further measure the capacitors and printed circuit boards with the help of 2D cameras.

A smart combination of robotics and image processing

Image processing thus plays a crucial role in the success of this concept. Glaub’s engineers worked together with Wendeburg-based M-VIS Solutions GmbH to choose the cameras suitable for this application. Cognex’s solutions partner M-VIS developed a solution with several cameras that both capture the data matrix codes on the blister packs and precisely measure and locate each individual component.

Vitali Burghardt, CEO of M-VIS Solutions, explains: “With the 100% absolute measurement of components and printed circuit boards, GL-THTeasy compensates for every inaccuracy in terms of components, gripping, workpiece carriers and conveyor belts.” This means that components that do not fit exactly are immediately eliminated.

Eight cameras per cell, including two 3D cameras

As part of a feasibility study, M-VIS — supported by Cognex — chose eight cameras, four for each robot arm. An In-Sight 7802M vision system measures the parts and provides the necessary information to correct the position of the gripper. A further system from the In-Sight 9912M series measures the circuit board and if necessary corrects the gripper's movement when it is placing the component on the board. The 3D surface-scan camera 3D-A5060 with patent-pending 3D LightBurst technology and integrated VisionPro image processing software “sees” the position of parts in the feed line.

Niko Glaub explains this step in more detail: “In each process step, the cameras capture the actual position of the component, the gripper and the circuit board in relation to the electronic component. In other words, the ‘legroom’ of the components is aligned with the actual dimensions of the assembly positions. First of all, this allows the component to be automatically found and removed, and then enables totally accurate through-hole mounting on the basis of actual position data.”

This approach offers a further advantage: since the movements are controlled based on cameras, the operators can generate a new placement model without programming. The camera images produced serve as a basis for this. This simplifies and accelerates not only assembly but also conversion. The GL-THTeasy robot cell is thus a prime example of flexible automation offering a smart solution for both current and future requirements.

Short cycle time, rapid amortization

ABB YuMi's two arms work simultaneously round the clock, allowing 24/7 operation at high speed with a very short cycle time, which can be under three seconds depending on the components to be installed and the feed. The amortization period is also impressive, coming to around fourteen months from GL-THTeasy's first use. The new robot cell therefore scores points on several counts, which support its use: innovation, reliability, efficiency and future viability. With Glaub and M-VIS, there is no doubt that this smart solution will persuade many other electronic manufacturing companies in the future to automate the process step for printed circuit board assembly with this flexible and efficient method